Compact-2D: A Physical Design Methodology to Build Commercial-Quality Face-to-Face-Bonded 3D ICs

Article Details
Title:	Compact-2D: A Physical Design Methodology to Build Commercial-Quality Face-to-Face-Bonded 3D ICs
Article URLs:	https://doi.org/10.1145/3177540.3178244
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Authors:	Bon Woong Ku	Georgia Institute of Technology
	Kyungwook Chang	Georgia Institute of Technology
	Sung Kyu Lim	Georgia Institute of Technology
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DBLP Key:	conf/ispd/KuCL18
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ACM International Symposium on Physical Design, ISPD 2018