ACM International Symposium on Physical Design, ISPD 2018

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Title: Interconnect Optimization Considering Multiple Critical Paths
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Authors: Jiang Hu
  • Texas A&M University
Ying Zhou
  • IBM Corporation
Yaoguang Wei
  • IBM Corporation
Stephen T. Quay
  • IBM Corporation
Lakshmi N. Reddy
  • IBM Research
Gustavo E. Téllez
  • IBM Research
Gi-Joon Nam
  • IBM Research
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NSF Award Numbers: 1525749
DBLP Key: conf/ispd/HuZWQRTN18
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