| Title: |
Design high bandwidth-density, low latency and energy efficient on-chip interconnect |
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| Authors: |
Yong Wang |
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University of Rochester, Department of Electrical and Computer Engineering
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| Hui Wu |
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University of Rochester, Department of Electrical and Computer Engineering
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| Sharing: |
Unknown
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| Verification: |
Authors have
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information
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| Artifact Evaluation Badge: |
none
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| DBLP Key: |
conf/islped/WangW17
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| Author Comments: |
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