ACM International Conference on Computer-Aided Design, ICCAD 2016


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Title: Redistribution layer routing for integrated fan-out wafer-level chip-scale packages
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Authors: Bo-Qiao Lin
  • National Taiwan University, Graduate Institute of Electronics Engineering
Ting-Chou Lin
  • National Taiwan University, Graduate Institute of Electronics Engineering
Yao-Wen Chang
  • National Taiwan University, Graduate Institute of Electronics Engineering
  • National Taiwan University, Department of Electrical Engineering
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DBLP Key: conf/iccad/LinLC16
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