| Title: |
SAINT: handling module folding and alignment in fixed-outline floorplans for 3D ICs |
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| Authors: |
Jai-Ming Lin |
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National Cheng Kung University, Department of Electrical Engineering
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| Po-Yang Chiu |
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National Cheng Kung University, Department of Electrical Engineering
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| Yen-Fu Chang |
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National Cheng Kung University, Department of Electrical Engineering
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| Sharing: |
Unknown
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| Verification: |
Authors have
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| Artifact Evaluation Badge: |
none
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| DBLP Key: |
conf/iccad/LinCC16
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| Author Comments: |
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