HeatWatch: Improving 3D NAND Flash Memory Device Reliability by Exploiting Self-Recovery and Temperature Awareness

Article Details
Title:	HeatWatch: Improving 3D NAND Flash Memory Device Reliability by Exploiting Self-Recovery and Temperature Awareness
Article URLs:	https://doi.org/10.1109/HPCA.2018.00050 http://doi.ieeecomputersociety.org/10.1109/HPCA.2018.00050
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Authors:	Yixin Luo	Carnegie Mellon University
	Saugata Ghose	Carnegie Mellon University
	Yu Cai	Carnegie Mellon University
	Erich F. Haratsch	Seagate Technology
	Onur Mutlu	ETH Zürich Carnegie Mellon University
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DBLP Key:	conf/hpca/LuoGCHM18
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IEEE International Symposium on High Performance Computer Architecture, HPCA 2018