Design Automation Conference, DAC 2017


Article Details
Title: On Mitigation of Side-Channel Attacks in 3D ICs: Decorrelating Thermal Patterns from Power and Activity
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Authors: Johann Knechtel
  • New York University Abu Dhab, Electrical and Computer Engineering
Ozgur Sinanoglu
  • New York University Abu Dhabi, Electrical and Computer Engineering
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DBLP Key: conf/dac/KnechtelS17
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