| Title: |
Invited - Cross-layer modeling and optimization for electromigration induced reliability |
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| Authors: |
Taeyoung Kim |
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University of California, Riverside, CA 92521, USA, Department of Computer Science and Engineering
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| Zeyu Sun |
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University of California, Riverside, CA 92521, USA, Department of Electrical Engineering
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| Chase Cook |
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University of California, Riverside, CA 92521, USA, Department of Electrical Engineering
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| Hengyang Zhao |
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University of California, Riverside, CA 92521, USA, Department of Electrical Engineering
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| Ruiwen Li |
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University of California, Riverside, CA 92521, USA, Department of Electrical Engineering
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| Daniel Wong |
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University of California, Riverside, CA 92521, USA, Department of Electrical Engineering
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| Sheldon X.-D. Tan |
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University of California, Riverside, CA 92521, USA, Department of Electrical Engineering
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| Sharing: |
Unknown
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| Verification: |
Authors have
not verified
information
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| Artifact Evaluation Badge: |
none
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| NSF Award Numbers: |
1255899
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| DBLP Key: |
conf/dac/KimSCZLWT16
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| Author Comments: |
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