Design Automation Conference, DAC 2016


Article Details
Title: Physics-based full-chip TDDB assessment for BEOL interconnects
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Authors: Xin Huang
  • University of California, Riverside, CA 92521, USA, Department of Electrical Engineering
Valeriy Sukharev
  • Mentor Graphics Corporation, Fremont, CA 94538, USA, Design to Silicon, Calibre
Zhongdong Qi
  • University of California, Riverside, CA 92521, USA, Department of Electrical Engineering
Taeyoung Kim
  • University of California, Riverside, CA 92521, USA, Department of Computer Science and Engineering
Sheldon X.-D. Tan
  • University of California, Riverside, CA 92521, USA, Department of Electrical Engineering
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NSF Award Numbers: 1527324, 1255899
DBLP Key: conf/dac/HuangSQKT16
Author Comments: This paper has described a preliminary version of the commercial grade tool-prototype.

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