Design Automation Conference, DAC 2017

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Title: Adaptation of Enhanced TSV Capacitance as Membrane Property in 3D Brain-inspired Computing System
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Authors: M. Amimul Ehsan
  • University of Kansas, Department of Electrical Engineering and Computer Science
Hongyu An
  • University of Kansas, Department of Electrical Engineering and Computer Science
Zhen Zhou
  • Intel Corporation
Yang Yi
  • University of Kansas, Department of Electrical Engineering and Computer Science
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DBLP Key: conf/dac/EhsanAZ017
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