| Article Details | ||
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| Title: | A Modular Smartphone for Lending | |
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| Authors: | Teddy Seyed |
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| Xing-Dong Yang |
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| Daniel Vogel |
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| Sharing: | Unknown | |
| Verification: | Authors have not verified information | |
| Artifact Evaluation Badge: | none | |
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| NSF Award Numbers: | 1657141 | |
| DBLP Key: | conf/uist/SeyedY017 | |
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